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W. Tang, B. Wang, S. Ethier, G. Kwasniewski, T. Hoefler, K. Z. Ibrahim, K. Madduri, S. Williams, L. Oliker, C. Rosales-Fernandez, T. Williams:

 Extreme Scale Plasma Turbulence Simulations on Top Supercomputers Worldwide

(In Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis (SC16), presented in Salt Lake City, Utah, pages 43:1--43:12, IEEE Press, ISBN: 978-1-4673-8815-3, Nov. 2016)

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Abstract

The goal of the extreme scale plasma turbulence studies described in this paper is to expedite delivery of reliable predictions on confinement physics in large magnetic fusion systems by using world-class supercomputers to carry out simulations with unprecedented resolution and temporal duration. This has involved architecture-dependent optimizations of performance scaling and addressing code portability and energy issues, with the metrics for multi-platform comparisons being “time to solution” and “energy to solution.” Realistic results addressing how confinement losses caused by plasma turbulence scale from present-day devices to the much larger $25 international ITER fusion facility have been enabled by innovative advances in the GTC-P code including (i) implementation of one-sided communication from MPI 3.0 standard; (ii) creative optimization techniques on Xeon Phi processors, including novel hole removing and particle packing algorithms, data alignment, and padding; and (iii) development of a new performance model for the key kernels of the PIC code.

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BibTeX

@inproceedings{,
  author={W. Tang and B. Wang and S. Ethier and G. Kwasniewski and T. Hoefler and K. Z. Ibrahim and K. Madduri and S. Williams and L. Oliker and C. Rosales-Fernandez and T. Williams},
  title={{Extreme Scale Plasma Turbulence Simulations on Top Supercomputers Worldwide}},
  year={2016},
  month={11},
  pages={43:1--43:12},
  booktitle={Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis (SC16)},
  location={Salt Lake City, Utah},
  publisher={IEEE Press},
  isbn={978-1-4673-8815-3},
}